Volume 07,Issue 04

Experimental Validation of Conductive Heat Transfer Theory: Thermal Resistivity and System Effects

Authors

M. Hossein Sehhat *, Ali Mahdianikhotbesara, Farzad Yadegari

Abstract
Fourier’s Law is a tool utilized within heat transfer theory to predict heat flow through a system. Fourier’s Law can be applied to establish an analogy for heat energy flow, much like Ohm’s Law for electrical voltage flow through a system. The various materials within layers act as resistors, preventing heat flow. With such analog, a heating circuit is established, it is possible to predict heat flow, thermal gradients, or thermal resistivity throughout a system, given the system parameters and sources of heat gain or loss. This study utilized an established ASTM standard to validate the model. An enclosed, guarded heat-flow technique following the ASTM E1225 was created. The heat was provided to the system as the temperature was tracked throughout the system, helping to validate the model and thermal resistivity analog. Overall, the results show that the physical lab setup demonstrated an acceptable accuracy compared to the theoretical model. Suggesting further that the model for thermal resistivity to predict the temperature and thermal resistivity is indeed valid and may be utilized in some select scenarios where the environment, materials, power flow, and insulating devices are well-controlled and well-monitored.

Keyword: Heat transfer, Conduction, Thermal resistivity, ASTM E1225.

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